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IEAP - Institute of Experimental and Applied Physics CTU - Czech Technical University in Prague
CTU - Czech Technical University in Prague
Publication  > Articles in Impacted Journals  > 'Vectors and submicron precision: redundancy and 3D stacking in silicon pixel detectors'
Vectors and submicron precision: redundancy and 3D stacking in silicon pixel detectors

Author

Year
2010

Scientific journal
Journal of Instrumentation 5 C06004, doi: 10.1088/1748-0221/5/06/C06004

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Abstract
Measurements are shown of GeV pions and muons in two 300μm thick, Si Medipix pixel detector assemblies that are stacked on top of each other, with a 25μm thick brass foil in between. In such a radiation imaging semiconductor matrix with a large number of pixels along the particle trail, one can determine local space vectors for the particle trajectory instead of points. This improves pattern recognition and track reconstruction, especially in a crowded environment. Stacking of sensor planes is essential for resolving directional ambiguities. Signal charge sharing can be employed for measuring positions with submicron precision. In the measurements one notices accompanying 'delta' electrons that emerge outside the particle trail, far beyond the boundaries of the 55μm pixel cells. The frequency of such corrupted position measurements is ~ one per 2.5mm of traversed Si.

Cite article as:
W. Wong, "Vectors and submicron precision: redundancy and 3D stacking in silicon pixel detectors", Journal of Instrumentation 5 C06004, doi: 10.1088/1748-0221/5/06/C06004 (2010)

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